| 摘要 |
PROBLEM TO BE SOLVED: To provide solder powder for producing a solder composition excellent in heating sag resistance, fusibility and storage stability even in the case of using solder powder having a high solder melting point and a small average particle diameter.SOLUTION: Solder powder is characterized in that aliphatic monocarboxylic acid or aromatic monocarboxylic acid having one or more hydroxyl groups in one molecule is attached to, adsorbed by or bonded to the surface of the solder powder to be treated. |
