发明名称 |
Apparatus for manufacturing semiconductor devices |
摘要 |
The present invention relates to an apparatus for the manufacture of semiconductor devices; comprising a bonding module (1) comprising a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure; and a load lock module (2) connected to the bonding module (1) and configured for wafer transfer to the bonding module (1) and connected to a first vacuum pumping device (5) configured to reduce the pressure in the load lock module (2) below atmospheric pressure. |
申请公布号 |
EP2432007(A3) |
申请公布日期 |
2017.03.22 |
申请号 |
EP20110009599 |
申请日期 |
2011.06.20 |
申请人 |
Soitec |
发明人 |
Broekaart, Marcel;Radu, Ionut |
分类号 |
H01L21/67;B32B38/18;H01L25/00 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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