| 发明名称 | Guard ring structure of semiconductor arrangement | ||
| 摘要 | Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring. | ||
| 申请公布号 | US9601625(B2) | 申请公布日期 | 2017.03.21 |
| 申请号 | US201414330285 | 申请日期 | 2014.07.14 |
| 申请人 | Taiwan Semiconductor Manufacturing Company Limited | 发明人 | Cheng Sheng-Fang;Liu Yen-Lin;Wu Chen-Chih;Lee Chien-Yuan |
| 分类号 | H01L29/06;H01L29/78;H01L29/423;H01L21/8234;H01L27/088 | 主分类号 | H01L29/06 |
| 代理机构 | Cooper Legal Group, LLC | 代理人 | Cooper Legal Group, LLC |
| 主权项 | 1. A semiconductor arrangement, comprising: a first guard ring surrounding at least a portion of a device, the first guard ring comprising: a first guard ring portion; anda second guard ring portion, the second guard ring portion being discontinuous from the first guard ring portion and the first guard ring portion coupled to the second guard ring portion by a metal layer; a first poly layer formed over the first guard ring; a second guard ring surrounding at least a portion of the first guard ring; and a second poly layer formed over the second guard ring. | ||
| 地址 | Hsin-Chu TW | ||