Magnetic contacts

摘要

Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.

主权项

1. A method, comprising:
embedding a first magnet into a first integrated circuit substrate, or a first electrical routing feature of the first integrated circuit substrate; generating a magnetic field between the first electrical routing feature of the first integrated circuit substrate and a second electrical routing feature of a second integrated circuit substrate, wherein the magnetic field extends across a gap between the first and second electrical routing features; and forming an interconnect structure between the first and second electrical routing features, wherein the interconnect structure comprises a plurality of conductive magnetic particles.