Semiconductor package and method of manufacturing the same

摘要

Provided is a semiconductor package and a method of making same, including a first package substrate; a first semiconductor chip mounted on the first package substrate and having a first pad and a second pad, wherein the first pad is provided on a top of the first semiconductor chip and the second pad is provided on a bottom of the first semiconductor chip, the bottom being an opposite surface of the top; and a clad metal provided on the first pad and electrically connecting the first semiconductor chip to one of a second semiconductor chip and second package substrate provided on the top of the first semiconductor chip.

主权项

1. A semiconductor package comprising:
a first package substrate; a first semiconductor chip mounted on the first package substrate and having a first pad and a second pad, wherein the first pad is provided on a top of the first semiconductor chip and the second pad is provided on a bottom of the first semiconductor chip, the bottom being an opposite surface of the top; a clad metal provided on the first pad and electrically connecting the first semiconductor chip to one of a second semiconductor chip and a second package substrate provided on the top of the first semiconductor chip,
wherein the clad metal comprises at least a first layer of metal and a second layer of metal, the first layer of metal with which the clad metal is in contact with the first pad being formed of a same type of metal as the first pad; and a solder ball provided between the second layer of metal and a second pad of the one of the second semiconductor chip and the second package substrate connected thereto.