System-in-package module and manufacture method for a system-in-package module

摘要

A system-in-package module includes a non-memory chip, a bundled memory, and an encapsulation package material. The non-memory chip has a plurality of pads. The bundled memory includes a first memory die and a second memory die side-by-side formed over a substrate, wherein the first memory die includes a first group of pads and the second memory die includes a second group of pads. The encapsulation package material encloses the non-memory chip and the bundled memory, and the non-memory chip is electronically coupling with the bundled memory through the plurality of pads, the first and the second group of pads. The first group of pads corresponds to the second group of pads by rotating a predetermined degree or by mirror mapping.

主权项

1. A system-in-package module, comprising:
a non-memory chip having a plurality of pads; a bundled memory comprising a first memory die and a second memory die, wherein the first memory die and the second memory die are side-by-side formed over a substrate, the first memory die comprises a first group of pads arranged over or near one side of the first memory die, and the second memory die comprises a second group of pads arranged over or near one side of the second memory die; an encapsulation package material enclosing the non-memory chip and the bundled memory, wherein the non-memory chip is electronically coupling with the bundled memory through the plurality of pads, the first group of pads, and the second group of pads; and at least one alignment mark disposed over a scribe line between the first memory die and the second memory die for positioning the scribe line and making the scribe line not to be cut; wherein the first group of pads correspond to the second group of pads by rotating a predetermined degree, wherein the predetermined degree is 90° or 270°.