发明名称 Process for interconnection of electronic power modules of a rotary electrical machine, and assembly of interconnected power modules obtained by means of this process
摘要 A method for interconnecting electronic power modules of a polyphase rotary electric machine. The power modules are disposed in open cavities of a heat sink and comprise substrates on which are provided MOSFETs of a synchronous rectifier bridge and integrated control circuits. The method comprises the production of: a planar connector (6) including at least one layer of conductive traces (64); a plurality of interconnection elements (512) arranged in multiple geometric formations and ultrasonically welded or brazed (S2) directly to the substrates (51) and/or the MOSFETs; and openings (65) in the planar connector (6) allowing the free passage of the upper ends (5120) of the connection elements (512) and a mechanical contact with the conductive traces (64). The electrical connections are obtained by means of laser (8) transmission welding (S1) or electric resistance welding.
申请公布号 US9601973(B2) 申请公布日期 2017.03.21
申请号 US201113885114 申请日期 2011.11.17
申请人 Valeo Equipements Electriques Moteur 发明人 Seidenbinder Regis;Lafabrie Bryann;Tauvron Fabrice;Dheripre Cyrille;Delplace David;Tunzini Marc;Guillard Romaric;Lopez Ruth;Wen Jie
分类号 H02K11/00;H02K15/00;H02K11/04 主分类号 H02K11/00
代理机构 Berenato & White, LLC 代理人 Berenato & White, LLC
主权项 1. Process for interconnection of at least two electronic power modules of a polyphase rotary electrical machine to one another, and of said power modules to specific components of said polyphase rotary electrical machine, said power modules comprising a substrate comprising a layer constituted by a first plurality of conductive tracks on which there are implemented semiconductor power components and integrated electronic control circuits of these components which are connected electrically by said conductive tracks, comprising a step consisting of arranging said substrates (51 to 53) in open cavities (41 to 43) on an upper surface of a support unit (4), such as to be incorporated in a first plane of the space, and a subsequent phase of production of said interconnections comprising at least the following steps: a step of production of first interconnection means constituting a flat connector (6) comprising at least one layer (64) constituted by a second plurality of conductive tracks which is supported by at least one plate (63), known as the lower plate, made of insulating material, such as to form a network of electrical connections with a predetermined configuration; a step of production of a plurality of connection elements (512) in each of said power modules (51 to 53), constituted by filamentary components made of conductive material, with specific geometric forms, and of their electrical connections, by soldering or welding by ultrasound, at a first lower end (5121), on said conductive tracks of the substrates (51 to 53) and/or on said electronic power components, such that they are incorporated on planes substantially at right angles to said first plane of the space; a step of production of recesses (65) in at least said lower plate (63) of said flat connector (6), the spatial distribution of said recesses corresponding to the spatial distribution of said connection elements (512); a step of positioning said flat connector (6) above said connection elements (512), on a plane parallel to said first plane of the space, such that second, upper ends (5120) of said connection elements (512) can be put into contact with said conductive tracks (64) of said connector (6) through said openings (65); and the production of electrical connections between said upper ends (5120) of said connection elements (512) and said conductive tracks (64), by welding.
地址 FR