Encapsulation for an organic electronic device

摘要

An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

主权项

1. An organic electronic device comprising:
a substrate; an active layer disposed on the substrate; a thin-layer encapsulation directly disposed on the active layer; a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material; a covering layer directly disposed on the first adhesive layer; and a second adhesive layer arranged circumferentially around the first adhesive layer, wherein the second adhesive layer is free of the getter material, wherein the active layer has edges, lateral surfaces and a main surface facing away from the substrate, wherein the thin-layer encapsulation covers the lateral surfaces and the main surface of the active layer facing away from the substrate, wherein the second adhesive layer covers lateral surfaces of the thin-layer encapsulation and a main surface of the thin-layer encapsulation partly, wherein a thickness of the thin-layer encapsulation is between 10 nm and 500 nm, and wherein the covering layer is a metal foil or a plastic foil.