发明名称 |
Probing method, probe card for performing the method, and probing apparatus including the probe card |
摘要 |
A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate. |
申请公布号 |
US9599663(B2) |
申请公布日期 |
2017.03.21 |
申请号 |
US201314085945 |
申请日期 |
2013.11.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Kang Sang-Boo;Lim Ki-Sub |
分类号 |
G01R21/00;G01R31/28 |
主分类号 |
G01R21/00 |
代理机构 |
Lee & Morse P.C. |
代理人 |
Lee & Morse P.C. |
主权项 |
1. A probe method, the method comprising:
setting an allowable temperature range, the allowable temperature range ensuring contact between a pad of a circuit substrate and a needle of a probe card, a test temperature of the circuit substrate being in the allowable temperature range; providing the probe card with a probe temperature within the allowable temperature range, such that the probe card reaches the probe temperature before reaching the test temperature of the circuit substrate; after the probe card reaches the probe temperature, contacting the needle of the probe card to the pad of the circuit substrate; and supplying a test current to the pad through the needle to test the circuit substrate, the circuit substrate being at the test temperature. |
地址 |
Suwon-si, Gyeonggi-Do KR |