Milling/surfacing method and device

摘要

A method for milling a planar surface, during which a milling cutter, an axis of rotation of which is perpendicular to a surface to be machined, is moved in a direction parallel to the plane of the surface, to machine the surface in a single machining operation, over a predetermined layer of material, using a single milling head, and the milling cutter, in a same axial position relative to the surface to be machined, simultaneously carries out rough working, at least one intermediate finishing operation, and a finishing operation over a same layer of material.

主权项

1. A method for milling a planar surface, comprising:
moving a milling cutter, a rotation axis of which is perpendicular to a surface to be machined, in a direction parallel to a plane of the surface so as to machine the surface to be machined in a single machining operation to a predetermined material thickness by a single milling head including two or more of sets of cutting tips distributed around the milling head, each of the sets including a first tip having a first cutting edge, a second tip having a second cutting edge, and a third tip having a third cutting edge, the cutting edges being offset radially with respect to one another at a same axial position on the milling cutter; and the milling cutter simultaneously carrying out, in a same axial position with respect to the surface to be machined, a rough machining operation via the first tip, at least one intermediate finish machining operation via the second tip, and a finish machining operation via the third tip, to a same material thickness.