发明名称 Method and apparatus for welding printed circuits
摘要 The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction.;In particular, a magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18).;By this method, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral area, thus achieving the maximum energy efficiency during the bonding process.;The invention further comprises an induction head and a bonding apparatus for performing the method.
申请公布号 US9603264(B2) 申请公布日期 2017.03.21
申请号 US201113878686 申请日期 2011.10.11
申请人 CEDAL EQUIPMENT S.R.L. 发明人 Ceraso Bruno
分类号 H05K3/46 主分类号 H05K3/46
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A method for induction bonding of a printed circuit multilayer stack (18), wherein the stack comprises a plurality of conducting layers (19) incorporating the printed circuit layout (21), the conducting layers respectively being separated from each other by a plurality of insulating layers (20) made of dielectric material impregnated with resin, a plurality of spacers (25) being arranged continually along the edges of the conducting layers (19) in order to keep the conducting layers spaced apart along the edges, wherein the method comprises the following steps: inducing a magnetic flux at predetermined locations of the multilayer stack (18) with an induction head (3) comprising a C-shape inductor core (12) of magnetically permeable material in order to achieve the localized heating of the resin, wherein the inducing step comprises inducing the magnetic flux in a multitude of the plurality of spacers (25) simultaneously to simultaneously bond the multitude of spacers to the adjacent conducting layers, and wherein the C-shaped core (12) of the induction head (3) comprises magnetic poles of opposed magnetic polarity oriented towards the bonding area, so that a magnetic flux with opposite signs is induced by the induction head at a plurality of locations of the multilayer stack (18) to achieve the simultaneous bonding.
地址 Milan IT