Semiconductor package

摘要

A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.

主权项

1. A stacked semiconductor package, comprising:
a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; wherein: the first semiconductor package further includes: a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin and located above the first semiconductor element and located in a region above a region between two ends of the first semiconductor element; and a thermal via connected to the conductive layer and located on the first circuit board in an area where the first semiconductor is not located, the conductive layer and thermal via configured to allow heat generated from the first semiconductor element to escape below the first semiconductor package.