Cavity package with die attach pad

摘要

A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal expansion matched to the coefficient of thermal expansion of a semiconductor device to be affixed to the substrate. The semiconductor device is typically attached to an exposed top surface of the substrate. The cavity package also includes a plastic portion molded to the leadframe forming a substrate cavity. The substrate cavity allows access to the exposed top surface of the substrate for affixing the semiconductor device. The cavity package also include a connective element for grounding a lid through an electrical path from the lid to the interposer.

主权项

1. A cavity package receiving a semiconductor device therein, comprising:
a metal leadframe; a substrate attached to the leadframe, the substrate having a coefficient of thermal expansion matched to a coefficient of thermal expansion of the semiconductor device to be affixed to the substrate; and a plastic portion molded to the leadframe defining a substrate cavity including an exposed top surface of the substrate to affix the semiconductor device; wherein the leadframe includes an interposer and the substrate is attached to the interposer; the substrate includes electrically isolated metallic features on the top surface to wire bond with the semiconductor device; the metallic features are capable of defining a ground plane and being connected with the interposer; the cavity package further includes:
a metal lid attached to the plastic portion to close and encapsulate the substrate cavity; anda connective element to ground the lid by an electrical path from the lid to the interposer.