Printed wiring board and connector connecting the wiring board

摘要

A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The wirings (9, 11) are disposed at the other surface side of the base substrate (3). The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the one surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the pads (15a).

主权项

1. A printed wiring board comprising:
a base substrate; a plurality of pads for electrical connection that are disposed at one surface side of the base substrate and at a connection end portion of the base substrate to be connected with a connector, the plurality of pads forming front and rear two arrays when viewed in a direction of connection with the connector; a plurality of wirings that are connected with the pads; an engageable part that is formed at the connection end portion of the base substrate and is to be engaged with an engagement part of the connector in a direction of disconnection, and a reinforcement layer that is disposed at the one surface side of the base substrate and at a frontward side with respect to the engageable part when viewed in a direction of connection with the connector, and that is formed integrally with any of the pads, wherein the plurality of wirings include first wirings and second wirings, the first wirings are disposed at the other surface side of the base substrate and are connected with first pads of the front array of the plurality of pads disposed at the one surface side of the base substrate via vias penetrating the base substrate, the second wirings are disposed at the other surface side of the base substrate and are connected with second pads of the rear array of the plurality of pads disposed at the one surface side of the base substrate via vias penetrating the base substrate, each of the wirings has an expanded-width part, each of the first wirings has a first expanded-width part provided at a position on the other surface side of the base substrate corresponding to the first pads, each of the second wirings has a part that is formed to have a second expanded-width part provided at a position on the other surface side of the base substrate corresponding to the second pads, each of the first expanded-width parts has substantially the same shape as the shape of the first pads, and each of the second expanded-width parts has substantially the same shape as the shape of the second pads.