发明名称 Test structure for seal ring quality monitor
摘要 A semiconductor structure includes a daisy chain adjacent to an edge of a semiconductor chip. The daisy chain includes a plurality of horizontal metal lines distributed in a plurality of metallization layers, wherein the horizontal metal lines are serially connected; a plurality of connecting pads in a same layer and electrically connecting the horizontal metal lines, wherein the connecting pads are physically separated from each other; and a plurality of vertical metal lines, each connecting one of the connecting pads to one of the horizontal metal lines, wherein one of the plurality of connecting pads is connected to one of the plurality of horizontal metal lines by only one of the plurality of vertical metal lines; and a seal ring adjacent and electrically disconnected from the daisy chain.
申请公布号 US9601443(B2) 申请公布日期 2017.03.21
申请号 US200711706940 申请日期 2007.02.13
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Tsai Hao-Yi;Hsu Shih-Hsun;Chang Shih-Cheng;Hou Shang-Yun;Chen Hsien-Wei;Tsai Chia-Lun;Liu Benson;Jeng Shin-Puu;Wu Anbiarshy
分类号 H01L21/66;H01L23/48;H01L23/58;H01L23/00 主分类号 H01L21/66
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. A semiconductor structure comprising: a daisy chain adjacent an edge of a semiconductor chip, the daisy chain comprising: a plurality of horizontal metal lines distributed in a plurality of metallization layers, wherein the horizontal metal lines are serially connected;a plurality of connecting pads in a same layer and electrically connecting the horizontal metal lines, wherein the plurality of connecting pads are physically separated from each other; anda plurality of vertical metal lines, each connecting one of the plurality of connecting pads to one of the horizontal metal lines, wherein one of the plurality of connecting pads is connected to one of the plurality of horizontal metal lines by only one of the plurality of vertical metal lines; a seal ring adjacent to and electrically disconnected from the daisy chain, wherein the seal ring comprises a side parallel to a respective side of the daisy chain, and wherein the seal ring is on an inner side of the daisy chain; two bumps on the semiconductor chip, wherein the two bumps are in a region encircled by the seal ring; and two metal lines, each being over and crossing the seal ring, wherein each of the two metal lines connects one of the two bumps to the daisy chain.
地址 Hsin-Chu TW