| 发明名称 | Three-dimensional package structure | ||
| 摘要 | The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer. | ||
| 申请公布号 | US9601412(B2) | 申请公布日期 | 2017.03.21 |
| 申请号 | US201213612852 | 申请日期 | 2012.09.13 |
| 申请人 | CYNTEC CO., LTD. | 发明人 | Chen Da-Jung;Liu Chun-Tiao;Wen Chau-Chun |
| 分类号 | H01L23/495;H01L23/552;H01L23/00;H01L25/10 | 主分类号 | H01L23/495 |
| 代理机构 | Litron Patent & Trademark Office | 代理人 | Teng Min-Lee;Litron Patent & Trademark Office |
| 主权项 | 1. A package structure, comprising: at least one first electronic device, wherein the at least one first electronic device is encapsulated by a molding body comprising a top surface, a bottom surface and a plurality of lateral surfaces connecting the top surface and the bottom surface, wherein the molding body is made of insulating material and the top surface of the molding body is flat; at least one conductive pattern, wherein at least one portion of the at least one conductive pattern is disposed on the top surface of the molding body; and a second electronic device disposed on said at least one portion of the at least one conductive pattern on the top surface of the molding body, wherein a first lead and a second lead of the second electronic device are respectively in contact with and electrically connected to a first portion and a second portion of said at least one portion of the at least one conductive pattern. | ||
| 地址 | Hsinchu TW | ||