发明名称 |
Copper nanorod-based thermal interface material (TIM) |
摘要 |
A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters. |
申请公布号 |
US9601406(B2) |
申请公布日期 |
2017.03.21 |
申请号 |
US201313782893 |
申请日期 |
2013.03.01 |
申请人 |
Intel Corporation |
发明人 |
Jha Chandra M.;Eid Feras;Swan Johanna M.;Gupta Ashish |
分类号 |
H01L23/34;H01L21/8238;H01L23/373;H01L23/00;H01L23/433 |
主分类号 |
H01L23/34 |
代理机构 |
Blakely, Sokoloff, Taylor & Zafman LLP |
代理人 |
Blakely, Sokoloff, Taylor & Zafman LLP |
主权项 |
1. A thermal interface material, comprising:
a plurality of copper nanorods, each having a first end thermally coupled with a first surface and a second end extending toward a second surface, wherein the second surface is copper; and a plurality of copper nanorod branches extending from each second end, wherein the copper nanorod branches have a Cu—Cu metallurgic bond to the second surface. |
地址 |
Santa Clara CA US |