Subsurface wires of integrated chip and methods of forming

摘要

Various embodiments include methods and integrated circuit structures. One method includes masking a structure with a mask to cover at least a portion of the structure under the mask, selectively implanting a material through a semiconductor layer and into a buried insulator layer forming an implant region. The implant region is substantially parallel to and below an upper surface of the structure. The method may also include masking an additional portion of the structure; etching a set of access ports though the semiconductor layer and partially through the insulator layer into the implant region; etching at least one tunnel below the upper surface of the structure in the implant region using the set of access; and depositing a conductor into the at least one tunnel and the set of access ports.

主权项

1. A method comprising:
masking a structure with a mask to cover at least a portion of the structure under the mask, the structure comprising: a substrate, a buried insulator layer disposed above the substrate, and a semiconductor layer disposed above the buried insulator layer; implanting a material through the semiconductor layer and into the buried insulator layer forming an implant region, wherein the implant region is substantially parallel to and below an upper surface of the structure; masking an additional portion of the structure with an additional mask to cover an additional portion under the additional mask; etching a set of access ports though the semiconductor layer and partially through the insulator layer into the implant region in the buried insulator layer; etching at least one tunnel below the upper surface of the structure in the implant region using the set of access ports by removing at least a portion of the implant region; and depositing a conductor into the at least one tunnel and the set of access ports.