Method for semiconductor wafer alignment

摘要

A semiconductor wafer is provided. The semiconductor wafer includes a base layer having an active region and an edge region. A number of semiconductor devices is formed on the active region. The semiconductor wafer also includes a wafer identification. The wafer identification is formed on the edge region and used for identifying the semiconductor wafer. The semiconductor wafer further includes an alignment mark. The alignment mark is formed on the edge region and is used for performing an alignment process of the semiconductor wafer.

主权项

1. A method for forming at least one alignment mark on a semiconductor wafer, comprising:
providing the semiconductor wafer having an active region and an edge region separated from the active region by a boundary line, wherein the boundary line is spaced from the outer periphery of the edge region by a predetermined distance, and the outer boundary of the semiconductor wafer is defined by the outer periphery of the edge region and the outer periphery of the active region; forming a wafer identification on the edge region of the semiconductor wafer; forming a first alignment mark on the edge region of the semiconductor wafer; and forming a second alignment mark on the active region or on the edge region where the first alignment mark is located, wherein an included angle that is formed between the first alignment mark and the second alignment mark in a circumferential direction of the semiconductor wafer is between about 12 degrees and about 36 degrees.