Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

摘要

[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

主权项

1. A bonding substrate fabrication method for fabricating a substrate (“bonding substrate”) on which a bonding surface is formed, the bonding substrate fabrication method comprising:
a first surface treatment step of surface-treating a surface of a substrate by irradiation with radiated particles including energetic particles; and a second surface treatment step of surface-treating the substrate surface by irradiation with radiated particles including metal particles; wherein the bonding substrate is fabricated as a result of implementing the first surface treatment step and second surface treatment step; and implementation of the first surface treatment step and the second surface treatment step is controlled so that the metal particles will be distributed in a base material of a surface layer of the bonding substrate, and the implementation is controlled without forming a metal layer on the surface of the bonding substrate.