Contoured showerhead for improved plasma shaping and control

摘要

Semiconductor processing chamber showerheads with contoured faceplates, as well as techniques for producing such faceplates, are provided. Data describing deposition rate as a function of gap distance between a reference showerhead faceplate and a reference substrate may be obtained, as well as data describing deposition rate as a function of location on the substrate when the reference showerhead and the reference substrate are in a fixed arrangement with respect to each other. The two data sets may be used to determine offsets from a reference plane associated with the faceplate that determine a contour profile to be used with the faceplate.

主权项

1. A showerhead faceplate for use in a semiconductor manufacturing tool, the showerhead faceplate comprising:
a substantially circular structure having a bottom surface and a center axis, wherein, when the showerhead faceplate is used in a semiconductor manufacturing process, the bottom surface faces a substrate that is subject to the semiconductor manufacturing process, and wherein:
a plurality of gas distribution holes pass through the circular structure,the bottom surface is contoured and has a radial profile that varies with respect to normal distance from a reference plane perpendicular to the center axis, andthe radial profile includes:
a first linear segment that:
starts at the center axis,radiates outwards from the center axis, andis perpendicular to the center axis;a second linear segment that:
starts and ends at locations further from the center axis than either end of the first linear segment,radiates outwards from the center axis,is perpendicular to the center axis, andis offset from the first linear segment along the center axis; anda first transition segment that connects the first linear segment with the second linear segment.