发明名称 Method of fabricating sputtering target, sputtering target using the method, and method of manufacturing organic light-emitting display apparatus using the sputtering target
摘要 A method of fabricating a sputtering target includes preparing a first powder material including at least one of a tin oxide and a mesh-forming oxide; mixing the first powder material and a second powder material comprising carbon or a tin oxide to prepare a mixture; simultaneously performing a primary compression and primary sintering on the mixture in a reduction atmosphere; and simultaneously performing a secondary compression and secondary sintering on the mixture in the reduction atmosphere to prepare the sputtering target.
申请公布号 US9598764(B2) 申请公布日期 2017.03.21
申请号 US201414205624 申请日期 2014.03.12
申请人 SAMSUNG DISPLAY CO., LTD. 发明人 Shin Sang-Wook;Jung Sun-Young;Lee Il-Sang;Park Jin-Woo;Kim Dong-Jin
分类号 C04B35/457;C23C14/34;C23C14/08;H01J37/34;H01L51/52 主分类号 C04B35/457
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP
主权项 1. A method of fabricating a sputtering target, the method comprising: preparing a first powder material comprising at least one of a tin oxide and Sn2P2O7; mixing the first powder material and a second powder material to prepare a mixture, wherein the second powder material comprises carbon or a tin oxide; simultaneously performing a primary compression and a primary heating on the mixture in a reduction atmosphere; and simultaneously performing a secondary compression and a secondary heating on the mixture in the reduction atmosphere to prepare the sputtering target, wherein the primary heating is performed at a temperature of about 100° C. to about 550° C. and the secondary heating is performed at a temperature of about 150° C. to about 450° C.
地址 Gyeonggi-Do KR
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