Interconnect structure having subtractive etch feature and damascene feature

摘要

Methods of forming an interconnect structure include depositing a first conductive material on a substrate. Aspects include subtractively etching the conductive material to form a patterned first conductive layer, and depositing a dielectric layer on interconnect structure. Aspects also include depositing a second conductive material on the dielectric layer and removing the second conductive material through the top of the second metal liner.

主权项

1. An interconnect structure comprising:
a first insulator layer; a first dielectric layer on the first insulator layer; a subtractive etch feature comprising a first conductive material, the subtractive etch feature having a first subtractive etch vertical wall, a second subtractive etch vertical wall, and an angle between the first subtractive etch vertical wall and a horizontal plane that is less than 90 degrees; and a damascene feature comprising a second conductive material, the damascene feature having a first damascene vertical wall, a second damascene vertical wall, and an angle between the first damascene vertical wall and the horizontal plane that is greater than 90 degrees; wherein the first subtractive etch vertical wall is parallel to the second damascene vertical wall.