发明名称 Semiconductor device having elevated structure
摘要 A semiconductor device includes a gate stack overlying a substrate. The semiconductor device further includes a spacer on sidewalls of the gate stack, where a top surface of the spacer is above a top surface of the gate stack. Additionally, the semiconductor device includes a protection layer overlying the gate stack and filling at least a portion of a space surrounded by the spacer above the top surface of the gate stack. Furthermore, the semiconductor device includes a contact hole over the spacer, where the contact hole extends over the gate stack, and where a sidewall of the contact hole has a step-wise shape.
申请公布号 US9601587(B2) 申请公布日期 2017.03.21
申请号 US201514603861 申请日期 2015.01.23
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Sun Sey-Ping;Lee Tsung-Lin;Lin Chin-Hsiang;Chang Chih-Hao;Yeh Chen-Nan;Jong Chao-An
分类号 H01L29/423;H01L21/768;H01L29/49;H01L29/78;H01L29/66 主分类号 H01L29/423
代理机构 Hauptman Ham, LLP 代理人 Hauptman Ham, LLP
主权项 1. A semiconductor device comprising: a gate stack overlying a substrate; a spacer on sidewalls of the gate stack, wherein a top surface of the spacer is above a top surface of the gate stack; a continuous protection layer overlying the gate stack and completely filling a space surrounded by the spacer above the top surface of the gate stack, wherein the continuous protection layer is in direct contact with the substrate; and a contact hole over the spacer, wherein the contact hole extends over the gate stack, and wherein a sidewall of the contact hole has a step-wise shape, wherein an outer surface of the spacer forms an interface with the contact hole.
地址 TW