| 发明名称 | Heat management apparatus for an electronic device | ||
| 摘要 | A heat management apparatus for an electronic device that includes a heat spreader. The heat spreader has a top surface and a bottom surface. A first portion is coupled to the electronic device. A second portion extends away from the electronic device. The heat spreader has a heat conductivity of at least approximately 100 Watts per meter Kelvin (W/mK). In some configurations the heat spreader may comprise a woven graphite material or a graphene material with a heat conductivity of at least approximately 1000 W/mK. | ||
| 申请公布号 | US9600041(B2) | 申请公布日期 | 2017.03.21 |
| 申请号 | US201414444084 | 申请日期 | 2014.07.28 |
| 申请人 | Google Technology Holdings LLC | 发明人 | Ady Roger W.;Cavallaro Alberto R.;Lim David Kyungtag |
| 分类号 | H05K7/20;G06F1/20 | 主分类号 | H05K7/20 |
| 代理机构 | Faegre Baker Daniels LLP | 代理人 | Faegre Baker Daniels LLP |
| 主权项 | 1. A heat management apparatus for an electronic device comprising: a heat spreader having a top surface and a bottom surface opposite the top surface, and including a first portion coupled to the electronic device and a second portion comprising a planar configuration extending away from the electronic device, wherein the second portion of the heat spreader is flexible and configured to extend over adjoining surfaces of an outer body of the electronic device, wherein the heat spreader has a heat conductivity of at least approximately 100 Watts per meter Kelvin (W/mK); and wherein the first portion of the heat spreader is positioned within the electronic device, with the electronic device having a body opening through which the heat spreader extends to the second portion comprising the planar configuration thereof. | ||
| 地址 | Mountain View CA US | ||