| 发明名称 | Apparatus for filling a wafer via with solder | ||
| 摘要 | A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via. | ||
| 申请公布号 | US9603254(B2) | 申请公布日期 | 2017.03.21 |
| 申请号 | US201214129076 | 申请日期 | 2012.07.10 |
| 申请人 | KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY | 发明人 | Yoo Sehoon;Lee Chang Woo;Kim Jun Ki;Kim Jeong Han;Ko Young Ki |
| 分类号 | H05K3/00;H01L21/768 | 主分类号 | H05K3/00 |
| 代理机构 | Patent Office of Dr. Chung Park | 代理人 | Patent Office of Dr. Chung Park |
| 主权项 | 1. A wafer via solder filling device comprising: a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via hole formed in one surface in the accommodation space, thereby sealing the accommodation space; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via hole, wherein a porous plate which has a through-hole is disposed on a top surface of the wafer, to prevent the wafer from being bent by a suction force provided from the fixing unit. | ||
| 地址 | Cheonan KR | ||