Memory module and memory system

摘要

A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.

主权项

1. A computing system comprising:
a processor; and sets of semiconductor dies arranged in ranks on a printed circuit board, each of the sets of semiconductor dies in a same rank configured to communicate with the processor over a common channel, a number of the ranks arranged on the printed circuit board not being a power of two and the number of the ranks corresponding to one of three, five, six, and seven.