Control module manufacturing method

摘要

In one embodiment, a control module manufacturing method includes disposing a board, on which electronic components are mounted, in a case includes a top opening, injecting a filler into the case, pressing the filler from the surface side thereof by means of a jig, which comprises an upwardly convex hollow portion corresponding to taller ones of the electronic components with respect to the board and covers the opening and curing the filler.

主权项

1. A control module manufacturing method comprising:
disposing a board, on which taller electronic components and shorter electronic components are mounted, between side surfaces of a case comprising a bottom surface and a top opening; injecting a filler into the case to a position lower than an uppermost portion of the side surfaces so as to incompletely fill the case to a level incompletely covering the taller electronic components; pressing a jig into the incompletely filled case and against the incompletely filled filler from a surface side thereof, the jig comprising a jig body having an upwardly disposed convex portion forming a cavity accommodating the taller electronic components, the jig thereby covering the top opening and pressing the filler so that the filler flows upward from the incomplete fill level and into the cavity so as to completely cover the taller electronic components including uppermost sides thereof; and curing the pressed filler so as to integrate the pressed filler with the case.