发明名称 |
ELECTRICALLY-CONDUCTIVE FOAM EMI SHIELD |
摘要 |
An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a resilient layer of a thermoformable, electrically-conductive foam, the layer having first surface and a second surface defining a thickness dimension therebetween, and the layer having an interior portion surrounded by a perimeter portion. The interior portion of the layer is compressed through the thickness dimension thereof to form a top wall portion of the shield, with the thickness dimension of the perimeter portion extending downwardly from the top wall portion to form a side wall portion of the shield which together with the top wall portion defines at least a portion of the compartment. |
申请公布号 |
CA2738098(C) |
申请公布日期 |
2017.03.21 |
申请号 |
CA20092738098 |
申请日期 |
2009.09.18 |
申请人 |
PARKER-HANNIFIN CORPORATION |
发明人 |
BUNYAN, MICHAEL H.;WATCHKO, GEORGE R.;LIONETTA, WILLIAM G. |
分类号 |
H05K9/00;H01L23/552 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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