Reversely-installed photonic crystal LED chip and method for manufacturing same

摘要

A method of fabricating a flip-chip photonic-crystal light-emitting diode (LED) is disclosed. The method includes the steps of: providing an initial substrate including an epitaxial-growth surface and a light-output surface; performing a nanoimprint process on the epitaxial-growth surface of the initial substrate to form a nano-level patterned substrate; forming a flip-chip LED structure on the epitaxial-growth surface of the nano-level patterned substrate; and performing a nanoimprint process on the light-output surface of the nano-level patterned substrate to form the flip-chip photonic-crystal LED. The formation of the photonic-crystal structure on the light-output surface results in enhanced LED light extraction and emission efficiency.

主权项

1. A method of fabricating a flip-chip photonic-crystal light-emitting diode (LED), comprising:
providing an initial substrate comprising an epitaxial-growth surface and a light-output surface; performing a nanoimprint process on the epitaxial-growth surface of the initial substrate to form a nano-level patterned substrate; forming a flip-chip LED structure on the epitaxial-growth surface of the nano-level patterned substrate; and performing a nanoimprint process on the light-output surface of the nano-level patterned substrate to form a flip-chip photonic-crystal LED, wherein performing the nanoimprint process on the epitaxial-growth surface of the initial substrate includes:
cleaning the initial substrate and forming a first imprint resist layer on the epitaxial-growth surface of the initial substrate;pressing a first imprint mold onto the first imprint resist layer to transfer patterns of the first imprint mold into the first imprint resist layer;removing the first imprint mold and performing an etching process on the first imprint resist layer, thereby forming patterns in the epitaxial-growth surface of the initial substrate; andremoving the first imprint resist layer to form the nano-level patterned substrate.