Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device

摘要

A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor package and the second semiconductor package. The plate member has a plate body, protruding strips protruding toward its edges from the plate body, and leg portions respectively provided on the protruding strips. Each of the leg portions is disposed on a surface, which opposes one surface of a wiring substrate, of the protruding strip, and contacts the one surface of the wiring substrate. Thus, defective connection of connecting terminals due to warping of the wiring substrate and loading inclination of the first semiconductor package is reduced, resulting in an improved yield.

主权项

1. A stacked semiconductor device comprising:
a first semiconductor package having
a first semiconductor element, anda first wiring substrate having a pair of surfaces, on one of which the first semiconductor element is mounted, and on the other of which a plurality of connecting conductor pads each connected to a connecting terminal are formed, wherein a plurality of first conductor pads are formed on one or the other surface of the wiring substrate; a second semiconductor package being disposed at a side in opposition to the one surface of the first wiring substrate of the first semiconductor package, and having
a second semiconductor element, anda second wiring substrate having a pair of surfaces, on one of which the second semiconductor element is mounted, wherein a plurality of second conductor pads are formed on one or the other surface of the second wiring substrate; a plate member having
a plate body arranged between the first and second semiconductor packages, and fixed to the first and second semiconductor packages, anda plurality of protruding strips protruding from a base end at the plate body to a position in opposition to an edge of the first wiring substrate; a plurality of metal wirings each for connecting electrically each of the first conductor pads to each of the second conductor pads; and an encapsulating resin for encapsulating at least the plurality of first conductor pads, the plurality of second conductor pads and the plurality of metal wirings, wherein the plate member has a plurality of leg portions contacting the one surface of the first wiring substrate.