Wiring substrate, manufacturing method therefor, and semiconductor package

摘要

A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes a first surface on which the adhesive layer is provided and a second surface on an opposite side of the first surface. The wiring substrate also includes a wiring provided on the second surface of the substrate, and a notch part that penetrates the substrate in a thickness direction of the substrate, with the notch part being formed by notching the wiring substrate inward from an outer edge part of the substrate from a plan view. The adhesive layer covers an end surface of the substrate that is exposed in an inner wall surface of the notch part.

主权项

1. A wiring substrate comprising:
a heat radiation plate; a substrate provided on the heat radiation plate interposed by an adhesive layer, the substrate including a first surface on which the adhesive layer is provided, and a second surface on an opposite side of the first surface; a wiring provided on the second surface of the substrate; and a notch part that penetrates the substrate in a thickness direction of the substrate, the notch part being formed by notching the substrate inward from an outer edge part of the substrate from a plan view, wherein the adhesive layer covers an end surface of the substrate that is exposed in an inner wall surface of the notch part.