Semiconductor device and method for making semiconductor device

摘要

A semiconductor device includes: a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a semiconductor element mounted on the main surface of the substrate and having at least one element pad; a wire having a bonding portion bonded to the element pad; and a sealing resin formed on the main surface of the substrate for covering the wire and at least a portion of the semiconductor element. The semiconductor element has an element exposed side surface that faces in a direction crossing the thickness direction of the substrate and is exposed from the sealing resin.

主权项

1. A semiconductor device comprising:
a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a first, a second and a third sensor elements each having at least one element pad and mounted on the main surface of the substrate; a control element that processes outputs from the first, the second and the third sensor elements; and a sealing resin formed on the main surface of the substrate, and covering the control element and at least a portion of each of the sensor elements, wherein the first sensor element includes an element side surface that faces in a direction crossing the thickness direction of the substrate, the second sensor element and the third sensor element are mounted on the control element so as to be spaced apart from the substrate, the first sensor element has a first main portion and a second main portion, the second main portion has a bonding surface on which the element pad of the first sensor element is formed, and the element pad of the first sensor element becomes thinner as proceeding toward the first main portion.