Printed wiring board, semiconductor package, and method for manufacturing printed wiring board

摘要

A printed wiring board includes a first interlayer, a first conductive layer on first-surface side of the first interlayer, a second conductive layer on second-surface side of the first interlayer, a first buildup layer including interlayers and conductive layers and formed on first surface of the first interlayer, and a second buildup layer including interlayers and conductive layers and formed on second surface of the first interlayer. The first conductive layer is formed such that the first conductive layer is embedded in the first interlayer and exposing surface on the first surface of the first interlayer, the second conductive layer is formed on the second surface of the first interlayer, and the interlayers in the first buildup layer include a second interlayer positioned adjacent to the first conductive layer and having the greatest thickness among the first interlayer and interlayers in the first and second buildup layers.

主权项

1. A printed wiring board, comprising:
a first resin insulation interlayer; a first conductive layer formed on a first-surface side of the first resin insulation interlayer; a second conductive layer formed on a second-surface side of the first resin insulation interlayer on an opposite side with respect to the first-surface side; a first buildup layer comprising a plurality of resin insulation interlayers and a plurality of conductive layers and formed on a first surface of the first resin insulation interlayer such that the first buildup layer is formed on the first conductive layer; and a second buildup layer comprising a plurality of resin insulation interlayers and a plurality of conductive layers and formed on a second surface of the first resin insulation interlayer such that the second buildup layer is formed on the second conductive layer, wherein the first conductive layer is formed such that the first conductive layer is embedded in the first resin insulation interlayer and exposing a surface on the first surface of the first resin insulation interlayer, the second conductive layer is formed on the second surface of the first resin insulation interlayer, and the plurality of resin insulation interlayers in the first buildup layer includes a second resin insulation interlayer positioned adjacent to the first conductive layer and having the greatest thickness among the first resin insulation interlayer, resin insulation interlayers in the first buildup layer, and resin insulation interlayers in the second buildup layer.