“L” shaped lead integrated circuit package

摘要

Various aspects provide for bending a bending a lead frame of a semiconductor device package into a shape of an “L” and mounting the package on a substrate. A horizontal portion of the bent lead-frame is about parallel with a surface of the package. A vertical portion of the bent lead frame is configured to extend the horizontal portion beyond the surface of the package. A device may be mounted between the substrate and the package.

主权项

1. A small outline package for supporting a semiconductor, the package comprising:
a case enclosing the semiconductor; and an “L” shaped lead-frame connected to the semiconductor and supported by the case, the lead-frame having a horizontal portion attached to a substrate and a vertical portion that extends vertically adjacent to a side of the case to create a separation between the case and the horizontal portion, the separation providing clearance for mounting a device in a footprint of the case.