| 摘要 |
Process for moulding a thermosetting resin, especially of epoxy resin type, in which a first mould is filled with the resin, while varying the temperature of the resin according to a first temperature programme, without exceeding the Tg of the resin. After filling the first mould, the resin is pressurized while varying the temperature of the resin according to a second temperature programme, without exceeding the Tg, and a drop in the pressure exerted by the resin on the mould is detected by locating the instant t1 where this pressure has a sudden change of slope. A second mould is filled with the thermosetting resin while following the first temperature programme. After filling the second mould, the resin is pressurized by following the second temperature programme up to an instant t2 close to t1. Starting from t2, the temperature of the resin is increased by exceeding the Tg. |
