发明名称 MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY
摘要 A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.
申请公布号 US2017079134(A1) 申请公布日期 2017.03.16
申请号 US201615363556 申请日期 2016.11.29
申请人 ELITE MATERIAL CO., LTD. 发明人 KUO Ya-Wen;YU Li-Chih;HO Ching-Hsin
分类号 H05K1/02;H05K1/09;H05K3/46 主分类号 H05K1/02
代理机构 代理人
主权项 1. A multi-layer printed circuit board comprising: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.
地址 Taoyuan County TW