发明名称 |
MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY |
摘要 |
A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers. |
申请公布号 |
US2017079134(A1) |
申请公布日期 |
2017.03.16 |
申请号 |
US201615363556 |
申请日期 |
2016.11.29 |
申请人 |
ELITE MATERIAL CO., LTD. |
发明人 |
KUO Ya-Wen;YU Li-Chih;HO Ching-Hsin |
分类号 |
H05K1/02;H05K1/09;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A multi-layer printed circuit board comprising:
a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers. |
地址 |
Taoyuan County TW |