| 发明名称 |
FINGERPRINT SENSING UNIT AND FINGERPRINT SENSING MODULE |
| 摘要 |
A fingerprint sensing unit includes a carrier substrate, a fingerprint sensing chip on an upper surface of the carrier substrate, a molding layer, a light-pervious cover layer on the molding layer, and an adhesive layer between the light-pervious cover layer and the molding layer. The fingerprint sensing chip is electrically connected to the carrier substrate. The molding layer covers the fingerprint sensing chip. |
| 申请公布号 |
US2017076134(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615156950 |
申请日期 |
2016.05.17 |
| 申请人 |
J-METRICS TECHNOLOGY Co., Ltd. |
发明人 |
LIN WEI-TING;KUO SHIH-CHUN |
| 分类号 |
G06K9/00 |
主分类号 |
G06K9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A fingerprint sensing unit, comprising:
a carrier substrate; a fingerprint sensing chip disposed on an upper surface of the carrier substrate and electrically connected to the carrier substrate; a molding layer, covering the fingerprint sensing chip; a light-pervious cover layer on the molding layer; and an adhesive layer between the light-pervious cover layer and the molding layer. |
| 地址 |
Taipei TW |
