METHOD OF CHEMICAL MECHANICAL POLISHING OF ALUMINA

摘要

A CMP method uses a slurry including colloidal metal oxide or colloidal semiconductor oxide particles (colloidal particles) in water. At least one particle feature is selected from (i) the colloidal particles having a polydispersity >30%, and (ii) mixed particle types including the colloidal particles having an average primary size >50 nm mixed with fumed oxide particles having average primary size <25 nm. A substrate having an alumina surface is placed into a CMP apparatus, and CMP is performed with a rotating polishing pad and the slurry to polish the alumina surface. The polydispersity is determined by a polydispersity formula for a distribution width (w) involving width w1 and width w2 at a second larger particle size. The polydispersity formula=(w2−w1)×100/dav which includes 63% of a total of the colloidal particles by volume and day is an average particle size of the colloidal particles.

主权项

1. A method of chemical mechanical polishing (CMP), comprising:
providing a slurry including: a plurality of colloidal metal oxide or colloidal semiconductor oxide particles (colloidal particles) in water, at least one particle feature selected from: (i) said plurality of colloidal particles having a polydispersity >30% determined by a polydispersity formula for a distribution width (w) involving a first width (w1) at a first particle size and a second width (w2) at a second larger particle size, said polydispersity formula=(w2−w1)×100/dav which includes 63% of a total of said plurality of colloidal particles by volume and said dav is an average particle size of said plurality of colloidal particles, and (ii) mixed particle types comprising said plurality of colloidal particles with an average primary particle size >50 nm mixed with fumed oxide particles having an average primary particle size <25 nm, and placing a substrate having an alumina surface into a CMP apparatus having a rotating polishing pad, and performing CMP with said rotating polishing pad and said slurry to polish said alumina surface.