Soldering Device Minimizing Voids When Soldering Printed Circuit Boards

摘要

A soldering device for soldering a printed circuit board includes at least one heating appliance melting solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board. At least one actuator mechanically oscillates the printed circuit board at a variable frequency of oscillation in a direction of a plane defioned by the printed circuit board. A second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board, rests against iand supported by a fixed stop.

主权项

1. A soldering device for soldering a printed circuit board, said device comprising:
at least one heating appliance heating molten solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board; at least one actuator mechanically oscillating the printed circuit board at a frequency of oscillation, wherein the actuator, in an area of a first lateral edge of the printed circuit board, indirectly or directly comes to rest against said printed circuit board in such a manner that an oscillation is introduced into the printed circuit board substantially parallel to a plane defined by the printed circuit board, said frequency of oscillation changing between a start frequency and an end frequency; and a fixed stop acting in a manner of a thrust bearing rests against and supports a second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board.