| 摘要 |
The vapor chamber (100) comprises a heating plate 110 for attaching to the heat source (180) and absorbing the heat therefrom, and a cooling plate (120) for dissipating the heat received from the heating plate (110) to an ambient space 185 outside the host device (181). The vapor chamber (100) further comprises a support frame (130) between the heating plate (110) and the cooling plate (120). The support frame (130) is mainly used as a mechanical frame for supporting the vapor chamber (100), and usually includes provisions, such as thread pins and screwing hooks, for mounting to the host device (181) or directly to the heat source (180). In particular, the heating plate (110), the support frame (130) and the cooling plate (120) are stacked and integrated together to form a rigid container (205) having a sealed space (210) therein. The rigid container (205) is used to provide mechanical support to the host device (181) when the host device (181) is integrated with the vapor chamber (100). Note that the rigid container (205) forms a bulk of the vapor chamber (100). |
