| 摘要 |
The present invention concerns a system for determining if a deterioration occurs in an interface of a semiconductor die of an electric power module, the electric power module further comprising a substrate and at least one electromechanical transductor, the semiconductor die and the at least one electromechanical transductor being placed on or embedded within the substrate, wherein the system comprises: - means for transferring at least one electric signal to the at least one electromechanical transductor, - means for measuring the impedance of the at least one electromechanical transductor, - means for comparing the impedance of the at least one electromechanical transductor to a predetermined value, - means for deciding that the deterioration occurs in the interface of the semiconductor die according to the comparison result. |
