| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A printed circuit board and a manufacturing method thereof are provided. A printed circuit board may include a first insulating layer comprising a photosensitive material on a core layer, a second insulating layer comprising a material comprising a reinforcing material on the first insulating layer, and a cavity formed in the first insulating layer and the second insulating layer. |
| 申请公布号 |
US2017079142(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615078452 |
申请日期 |
2016.03.23 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Jae-Ean;LEE Jung-Han;PARK Jin-Ho;CHO Jung-Hyun;BAEK Yong-Ho |
| 分类号 |
H05K1/18;H05K3/00;H05K1/09;H05K3/46;H05K1/02;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board, comprising:
a first insulating layer comprising a photosensitive material on a core layer; a second insulating layer comprising a reinforcing material on the first insulating layer; and a cavity formed in the first insulating layer and the second insulating layer. |
| 地址 |
Suwon-Si KR |
