PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

摘要

A package carrier includes a substrate, at least one heat conducting element, an insulating material, a first patterned circuit layer and a second patterned circuit layer. The substrate has an upper surface, a lower surface and a through hole. The heat conducting element is disposed inside the through hole and has a first surface and a second surface. The insulating material has a top surface, a bottom surface and at least one cavity extending from the top surface to the heat conducting element. The heat conducting element is fixed in the through hole by the insulating material, and the cavity exposes a portion of the first surface of the heat conducting element. The first patterned circuit layer is disposed on the upper surface and the top surface, and the second patterned circuit layer is disposed on the lower surface and the bottom surface.

主权项

1. A package carrier, comprising:
a substrate, having an upper surface and a lower surface opposite to each other, and a through hole connecting the upper surface and the lower surface; at least one heat conducting element, disposed inside the through hole and having a first surface and a second surface opposite to each other, wherein a thickness of the heat conducting element is smaller than a thickness of the substrate; an insulating material, located between the heat conducting element and an inner wall of the through hole, wherein the heat conducting element is fixed in the through hole by the insulating material, the insulating material has a top surface and a bottom surface opposite to each other, the top surface of the insulating material and the upper surface of the substrate are approximately coplanar, and the bottom surface of the insulating material, the lower surface of the substrate and the second surface of the heat conducting element are approximately coplanar, and the insulating material and the heat conducting element define at least one cavity extending from the top surface of the insulating material to the heat conducting element and the cavity exposes a portion of the first surface of the heat conducting element; a first patterned circuit layer, disposed on the upper surface of the substrate and the top surface of the insulating material, and exposing portions of the substrate and the top surface; and a second patterned circuit layer, disposed on the lower surface of the substrate and the bottom surface of the insulating material, and exposing portions of the substrate and the bottom surface.