SILICON SPUTTERING TARGET WITH SPECIAL SURFACE TREATMENT AND GOOD PARTICLE PERFORMANCE AND METHODS OF MAKING THE SAME

摘要

A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.

主权项

1. Sputter target assembly comprising a Si target and a backing plate bonded to said target, said Si target comprising a smooth mirror surface and a surface roughness of less than 15.0 Angstroms.