METHOD FOR TREATING INNER LAYER OF PRINTED CIRCUIT BOARD

摘要

The present invention relates to a method for treating an inner layer of a printed circuit board, wherein a chemical bonding layer is formed between a surface of a copper foil and a prepreg due to a reaction of a hydroxyl of a UV treated prepreg and a silane compound, thereby improving the adhesive strength of the copper foil and the prepreg, making it easy to control the thickness of the copper foil, and lowering the defect rate.