Method Of Forming 3D Integrated Circuit Package With Panel Type Lid

摘要

Presented herein is a package comprising a carrier device of a device stack and at least one top device of the device stack mounted on a first side of the carrier device. A lid is mounted on the first side of the carrier device, with a first portion of the lid attached to the carrier device and a second portion of the lid extending past and overhanging a respective edge of the carrier device. The lid comprises a recess disposed in a first side, and the at least one top device is disposed within the recess. A thermal interface material disposed on the top device and contacts a surface of the recess.

主权项

1. A method of forming a device, comprising:
providing a plurality of device stacks each having a first die mounted on a first side of a second die, the first die having a first width, and the second die having a second width greater than the first width; providing a lid panel having a plurality of lids separated by one or more dicing streets, each of the plurality of lids having a recess disposed in a first side of the respective lid, the first side of each of the plurality of lids forming a rim around the recess; mounting each of the plurality of device stacks on a respective one of the plurality of lids, the first side of the second die of each of the plurality of device stacks attached to the rim of the respective lid, and the first die of each of the plurality of device stacks extending at least partially into the recess of the respective lid; and cutting the lid panel, after the mounting each of the plurality of device stacks, by cutting the lid panel along the one or more dicing streets.