发明名称 |
EBEAM THREE BEAM APERTURE ARRAY |
摘要 |
Lithographic apparatuses suitable for, and methodologies involving, complementary e-beam lithography (CEBL) are described. In an example, a blanker aperture array (BAA) for an e-beam tool is described. The BAA includes three distinct aperture arrays of different pitch. |
申请公布号 |
US2017076905(A1) |
申请公布日期 |
2017.03.16 |
申请号 |
US201415122400 |
申请日期 |
2014.12.19 |
申请人 |
Intel Corporation |
发明人 |
BORODOVSKY Yan A.;NELSON Donald W.;PHILLIPS Mark C. |
分类号 |
H01J37/04;G03F7/20;H01L21/768;G03F1/20;H01J37/317;H01J37/302 |
主分类号 |
H01J37/04 |
代理机构 |
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代理人 |
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主权项 |
1. A blanker aperture array (BAA) for an e-beam tool, the BAA comprising:
a first array comprising a first column of openings along a first direction and having a first pitch, and comprising a second column of openings along the first direction and staggered from the first column of openings, the second column of openings having the first pitch; a second array comprising a third column of openings along the first direction and having a second pitch, and comprising a fourth column of openings along the first direction and staggered from the third column of openings, the fourth column of openings having the second pitch; and a third array comprising a fifth column of openings along the first direction and having a third pitch, and comprising a sixth column of openings along the first direction and staggered from the fifth column of openings, the sixth column of openings having the third pitch, wherein a scan direction of the BAA is along a second direction, orthogonal to the first direction. |
地址 |
Santa Clara CA US |