发明名称 FLIP-CHIP EMPLOYING INTEGRATED CAVITY FILTER, AND RELATED COMPONENTS, SYSTEMS, AND METHODS
摘要 A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.
申请公布号 US2017077574(A1) 申请公布日期 2017.03.16
申请号 US201615218626 申请日期 2016.07.25
申请人 QUALCOMM Incorporated 发明人 Lee John Jong-Hoon;Song Young Kyu;Jow Uei-Ming;Choi Sangjo;Zhang Xiaonan
分类号 H01P1/207;H01L23/66;H01L21/48;H01L23/60;H01L23/522;H05K1/02;H01L23/00 主分类号 H01P1/207
代理机构 代理人
主权项 1. An integrated circuit (IC) comprising: a semiconductor die comprising a plurality of die layers, the plurality of die layers comprising: at least one semiconductor layer;a plurality of interconnect layers for providing interconnections to the at least one semiconductor layer, at least one of the plurality of interconnect layers comprising: a first transmission line configured to transmit a first electromagnetic (EM) signal through a first signal transmission aperture; anda second transmission line configured to receive a second EM signal through a second signal transmission aperture; and a plurality of conductive elements interconnected to at least one of the plurality of interconnect layers, the plurality of conductive elements and at least one of the plurality of die layers defining an interior resonator cavity; the interior resonator cavity configured to receive the first EM signal from the first transmission line through the first signal transmission aperture, resonate the first EM signal to generate the second EM signal comprising a filtered EM signal of the first EM signal, and couple the second EM signal on the second transmission line through the second signal transmission aperture.
地址 San Diego CA US