发明名称 |
HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
The present invention provides a high-voltage metal-oxide-semiconductor transistor device and a manufacturing method thereof. First, a semiconductor substrate is provided and a dielectric layer and a conductive layer sequentially stacked on the semiconductor substrate. Then, the conductive layer is patterned to form a gate and a dummy gate disposed at a first side of the gate and followed by forming a first spacer between the gate and the dummy gate and a second spacer at a second side of the gate opposite to the first side, wherein the first spacer includes an indentation. Subsequently, the dummy gate is removed. |
申请公布号 |
US2017077250(A1) |
申请公布日期 |
2017.03.16 |
申请号 |
US201514922209 |
申请日期 |
2015.10.26 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Hsiao Shih-Yin;Chang Kai-Kuen |
分类号 |
H01L29/423;H01L29/66;H01L29/78 |
主分类号 |
H01L29/423 |
代理机构 |
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代理人 |
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主权项 |
1: A high-voltage (HV) metal-oxide-semiconductor (MOS) transistor device, comprising:
a semiconductor substrate; a gate structure disposed on the semiconductor substrate, wherein the gate structure comprises:
a gate;a first spacer disposed at a first side of the gate, wherein the first spacer comprises a first indentation;a second spacer disposed at a second side of the gate opposite to the first side; anda gate dielectric layer disposed between the gate and the semiconductor substrate and between the first spacer and the semiconductor substrate; a first doped region disposed in the semiconductor substrate and adjacent to the first spacer, wherein the first spacer is disposed between the first doped region and the gate; and a second doped region disposed in the semiconductor substrate and adjacent to the second spacer, wherein the second spacer is disposed between the second doped region and the gate. |
地址 |
Hsin-Chu City TW |